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PLATING RESIST MR-303F油墨
PLATING RESIST MR-303F是适合用于部分镀金用的遮蔽的单液性, 碱性剥离型抗镀油墨.此外也适合用于ITO用的蚀刻油墨.
 
PLATING RESIST MR-303F is one component, alkaline removable type Resist Ink developed for masking of partial Au plating.
Moreover, it is possible to be used as etching ink for ITO.
Main Feature
1. Cured film has flexibility, and available for a flexible board and a rigid board.
2. This ink has excellent resistance to Au plating( Electro-less),since the contamination to the plating solution
is very small, control of the solution is easy.
3. Possible to be used as etching ink for ITO.
Main Property
Items Representing value Remarks
Color Black color Visual
Viscosity at 25 deg.C 200 dPa・s Viscotester VT-04
Applicable Screen 150~250 Mesh Polyester Screen
Optimum Ink thickness after drying 10~20µm Thickness Meter
Dry Conditions 100deg.C × 10min Circulating Heat Oven
Adhesion 100 / 100 Cross-cut,tape peel test
Resistance to Electro-less Plating No penetration, No color change Ni Plating at 90deg.C for 30 min + Au Plating at 90deg.C for 40 min
Remove of the cured film 1~3 wt% NaOH Solution 30deg.C × 1~3 min Dipping
The above information obtained by actual measurement at our lab., and do not specified values.
< Shelf-life > Main body: 6 months --- Stored in 25 deg.C or below (cool and dark place).
Usage and handling precautions
1. If dilution is needed due to viscosity variation during operation, dilute with exclusive reducer #70 within 5%.
2. Drying should be done at the range of 100deg.C~130deg.C. Since drying time will vary based on s heat efficiency and ventilation capacity of used oven, please confirm your oven and set optimum condition.
3. This resist can be used for general Ni/Au plating solution without any inconvenience.
However, if it is used for special plating solution, it may cause the change in characteristics, depending on its composition. Please use it after checking fully. Flexibility test (JIS K 5600-5-1)
Mandrel diameter 8mmφ 6mmφ 4mmφ 3mmφ 2mmφ
Conventional products No Crack Crack Crack Crack Crack
MR-303F No Crack No Crack No Crack No Crack No Crack
Test board: Thickness 25µm/PI film
Screen mesh: 200mesh polyester screen
Dry condition: 100deg.C × 10min Circulating Heat Oven
Ink thickness after drying: Thickness 14~16µm
Elusion amount in Electro-less Ni Plating 
 
 ・Absorbance is high=Quantity of elution is large ・Absorbance is low=Quantity of elution is small Compared to Ni Plating new solution, absorbance peak which arise from elusion content from coated film can be confirmed at around 280nm for conventional product though, the peak can not be confirmed in MR-303F. <<Sample manufacture condition>>
Test Board: 5.6cm×4cm /PI film/4 pieces
Dry condition: 100deg.C × 10min Circulating Heat Oven
Ink thickness after drying: About 30µm
<<Ni plating condition>>
Plating solution: Product made by OKUNO CHEMICAL INDUSTRIES CO.,LTD
Dip condition: 80 deg.C × 4hr
<<Measurement condition>>
Testing equipment: Product made in SHIMADZU CORPORATION UV-1800
Kind of measurements: Absorbance
Measurement wavelength(nm): 200~900
ITO-proof etching liquid test 

<<Sample manufacture condition>>
Test Board: ITO/PET film
Screen mesh: 200mesh polyester screen
Dry condition: 100deg.C × 10min Circulating Heat Oven
Ink thickness after drying: Thickness 10~15µm
≪ITO etching liquid condition≫
Etching solution: Mixed acid ITO-02 Product made by KANTO CHEMICAL CO.,INC.
Dip condition: 45deg.C × 4min
 ≪Remove of the cured film≫
Remove solution: 3wt%NaOH
Dip condition: 30 deg.C × 1min
≪Measuring instrument condition≫
Measuring instrument Product made by YOKOGAWA ELECTRIC CORPORATION DEGITAL MLTIMETER 755S
Stripping test after thermal resistance 

<<Sample manufacture condition>>
Test Board: PI film・ Glass epoxy copper foil
Screen mesh: 200mesh polyester screen
Dry condition: 100deg.C × 10min Circulating Heat Oven
Ink thickness after drying: Thickness 10~15µm
Additional heating condition: 180℃×1-5hr/ Heat circulation oven
≪Remove of the cured film≫
Remove solution: 3wt%NaOH
Dip condition: 30 deg.C × 1min
Check strippability: Visual
 
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